The Challenge of Lower Temperature Soldering for Large Ball-Grid Array (BGA) Board-Level Assembly – Phase 1. Processing

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dc.contributor.authorHongwen Zhang
dc.contributor.authorFrancis Mutuku
dc.contributor.authorHuaguang Wang
dc.date.accessioned2026-03-18T12:35:05Z
dc.date.available2026-03-18T12:35:05Z
dc.date.issued2026
dc.identifier.issnhttp://journal.smta.org/index.php/smt/article/view/67
dc.identifier.urihttp://41.89.96.81:4000/handle/123456789/3637
dc.language.isoen
dc.publisherJournal of Surface Mount Technology
dc.titleThe Challenge of Lower Temperature Soldering for Large Ball-Grid Array (BGA) Board-Level Assembly – Phase 1. Processing
dc.typeArticle

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