The Challenge of Lower Temperature Soldering for Large Ball-Grid Array (BGA) Board-Level Assembly

Hongwen ZhangFrancis MutukuHuaguang Wang2026-03-182026-03-182026http://journal.smta.org/index.php/smt/article/view/67http://41.89.96.81:4000/handle/123456789/3637enThe Challenge of Lower Temperature Soldering for Large Ball-Grid Array (BGA) Board-Level Assembly – Phase 1. ProcessingArticle